Product Highlight

Remote Vacuum Pre-Aligner


  • High accuracy, performance and reliability
  • Cost-effective, seamless integration with the Genmarks vacuum robots
  • Versatility – measures different substrates sizes and shapes, both solid and transparent without adjustment.

Remote Vacuum Pre-Aligner

The RIVP is engineered for use with all Genmark vacuum robots, providing accurate, non-contact measurement of the eccentricity and the orientation of the substrate placement in vacuum environments.

The device can be arbitrarily placed inside the robot’s working envelope. The operations of the prealigner include measurement of the wafer displacement, calculation of the necessary compensation, and orientation of the notch (or the flat) to the desired angle.

The RIVP is designed for use in a wide range of applications regardless of the size, shape, transparency, and thickness of the substrates that are to be aligned. The prealigner can measure wafers with diameters ranging from 100 to 300mm and square substrates from 100 to 200mm.


Type Wafer, square substrates
Size Wafer: up to 300mm,
Square Substrates: Up to 200mm
Flat or Notch Orientation Flat, Notch
Alignment Accuracy  
Center Offset 0.002"
Angular Offset 0.1 degrees
Initial Offset Allowance 0.5"
Maximum Vacuum Pressure 10-8 torr
Servo Light-house Gap 0.350”
Physical Properties  
Length 10.685”
Width 6.000”
Height 8.050”
Standards Compliance  
Applicable Directives/Standards Machine Directive 89/392/EEC
Low Voltage Directive 73/23/EEC
89/336/EEC (EMC)
Standards to Verify Compliance EN 60204- 1:1997
EN ISO 12100- 2:2003
RIA R15.06:1999