The RIVP is engineered for use with all Genmark vacuum robots, providing accurate, non-contact measurement of the eccentricity and the orientation of the substrate placement in vacuum environments.
The device can be arbitrarily placed inside the robot’s working envelope. The operations of the prealigner include measurement of the wafer displacement, calculation of the necessary compensation, and orientation of the notch (or the flat) to the desired angle.
The RIVP is designed for use in a wide range of applications regardless of the size, shape, transparency, and thickness of the substrates that are to be aligned. The prealigner can measure wafers with diameters ranging from 100 to 300mm and square substrates from 100 to 200mm.
| Substrate | |
| Type | Wafer, square substrates |
| Size |
Wafer: up to 300mm, Square Substrates: Up to 200mm |
| Flat or Notch Orientation | Flat, Notch |
| Alignment Accuracy | |
| Center Offset | 0.002" |
| Angular Offset | 0.1 degrees |
| Initial Offset Allowance | 0.5" |
| Maximum Vacuum Pressure | 10-8 torr |
| Servo Light-house Gap | 0.350” |
| Physical Properties | |
| Length | 10.685” |
| Width | 6.000” |
| Height | 8.050” |
| Standards Compliance | |
| Applicable Directives/Standards |
Machine Directive 89/392/EEC Low Voltage Directive 73/23/EEC 89/336/EEC (EMC) SEMI S2-93A |
| Standards to Verify Compliance |
EN 60204- 1:1997 EN ISO 12100- 2:2003 RIA R15.06:1999 |
