Product Highlight

Stand-Alone Pre-Aligner


  • An autonomous device allows substrate alignment without participation of the robot
  • High accuracy, performance and reliability
  • Cost-effective, seamless integration with Genmark robots.
  • Versatility – measures all substrate sizes and shapes, both solid and transparent without adjustment.

Stand-Alone Pre-Aligner

The Stand-Alone Pre-Aligner is an autonomous device, which provides accurate, non-contact measurement of the eccentricity and orientation of substrate placement. It can be integrated with numerous substrate-manipulating devices when high alignment accuracy is required in the face of wide range initial substrate – misplacement.

The substrate can be placed onto a chuck or onto optional resting pins of the pre-aligner, depending on the shape of the robot’s end effector. The chuck is equipped with two servo-axes, X and Y, which enable it to move undemeath the substrate (which at that time is resting on the pins) and compensate for any misalignments. The operations of the Stand-Alone Pre-Aligner include wafer displacement measurement, calculation of the necessary compensation, and orientation of the notch (or the flat) to the desired angle. The high-resolution and accuracy of the chuck-movement guarantees very precise alignment in wide range substrate displacement.

The Stand-Alone Pre-Aligner is designed for use in a wide range of applications regardless of the size, shape, transparency, and thickness of the substrates that are to be aligned. The custom-designed lighthouse provides accurate and reliable measurement of both solid and transparent objects. The built-in optics allow for substrate thickness as much as 6mm. The pre-aligner can measure wafers with diameters ranging from 75 to 300mm and square substrates from 75 to 200mm. An optional moving lighthouse provides software-controlled adjustment to the different substrate sizes.


Works with Wafer, reticle
Wafer size 3", 100mm, 125mm, 150mm, 200mm, 300mm
Flat or Notch Orientation Flat, Notch
Alignment Accuracy  
Center Offset 0.0005"
Angular Offset 0.05"
Alignment time 300mm wafers : 4 sec
200mm wafers and smaller : 3.5 sec
Initial Offset Allowance 0.5"
Servo Light-house Gap 0.35", 0.5"
Physical Properties  
Vertical travel-body height No vertical travel
Length 12"
Width 10"
Height 11"
Standards Compliance  
Applicable Directives/Standards Machine Directive 89/392/EEC
Low Voltage Directive 73/23/EEC
89/336/EEC (EMC)
Standards to Verify Compliance EN 60204- 1:1997
EN ISO 12100- 2:2003
RIA R15.06:1999
Reliability per SEMI E10 / MCBF >10M