Product Highlight

Edge-Grip Pre-Aligner
Edge-Grip Pre-Aligner


  • Non-contact notch detection
  • Active edge contact wafer gripping mechanism
  • An autonomous device allowing substrate alignment without participation of the robot
  • Wafer buffer for increased throughput
  • High accuracy, performance and reliability
  • Cost-effective, seamless integration with Genmark Robots equipped with Edge-Gripping End-Effectors

Edge-Grip Pre-Aligner

The Edge-Grip Pre-Aligners are autonomous devices providing accurate and efficient wafer alignment and exceptional performance when combined with Genmark's Edge-Grip End-Effectors. The Edge-Grip Pre-Aligners are designed to work with 300mm and 200mm notched wafers regardless of their coating characteristics.

A specially designed motion sequence delivers vibration and stress free performance throughout the entire alignment process. The optional wafer buffer increases the throughput in both single and batch wafers transfer modes.


Wafer size 300 mm
Flat of notch orientation Notch
Alignment Accuracy  
Center Offset 0.004" (defined by the standard tolerances in the wafer size)
Angular Offset +/- 0.01 degrees
Alignment time Typical : 6 sec
Min : 4 sec
Initial Offset Allowance 0.04"
Servo Light-house Gap 0.75"
Physical Properties  
Vertical travel-body height No vertical travel
Length 12"
Width 10"
Height 11"
Standards Compliance  
Applicable Directives/Standards Machine Directive 89/392/EEC
Low Voltage Directive 73/23/EEC
89/336/EEC (EMC)
Standards to Verify Compliance EN 60204- 1:1997
EN ISO 12100- 2:2003
RIA R15.06:1999
Reliability per SEMI E10 / MCBF >10M