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GPR-SMV


The GPR-SMV is a high-performance dual-arm vacuum robot employing Genmark Automation's breakthrough GPR™ technology.

The robot combines the functionality of a two-link robotic arm for accurate, repeatable indexing and transportation of semiconductor wafers in vacuum processing capital equipment down to 10E-10 Torr, with the motion of dual arms performing wafer swapping at the process chambers, source cassettes etc. The mechanics of this robot contribute to its simplicity, modular design, easy control, teaching, and programming. The GPR™ technology makes the robot capable of compliantly interacting with misaligned cassettes and process modules, as well as delivering deflection compensation during wafer transport. Advanced motion planning in continuous smooth trajectories guarantees superior performance and effective implementation in various back-end layouts.

Features

  • Minimizes the idle-time of the process modules due to quicker wafer-swap
  • Advanced motion planning and axes coordination
  • Smallest footprint for its reach, provides the most efficient usage of the available space around the robotic system
  • Radial cassettes / process chambers access capabilities
  • Deflection compensation and compliant interaction with misaligned cassettes
  • DSP-based motion control for vibration –free wafer transport

Product Specifications

Arm Config. Motion Range Maximum Velocity Maximum Acceleration
T-axis** R-axis Z-axis T-axis R-axis Z-axis T-axis R-axis Z-axis
2 Link 6.5"-6.5"
(165.1-165.1
mm)
360° 25.6"
(650.24
mm)
3"
(76.2
mm)
500°/s 60"/s
(1524
mm/s)
5"/s 500°/sē 100"/sē
(2540
mm/sē)
5"/sē
(127
mm/sē)


Arm Config. Resolution Repeatability Diameter of the Minimum Working Envelope* Max. Wafer Size Robot Weight Payload
T-axis R-axis Z-axis T-axis R-axis Z-axis
2 Link 6.5"-6.5"
(165.1-165.1
mm)
0.000574° 0.000525"
(0.01333
mm)
0.0000066"
(0.00017
mm)
+/-0.01° +/-0.001"
(+/-0.0254
mm)
+/-0.001"
(+/-0.0254
mm)
30.5"
(655.3
mm)
300mm 247 lb
(112
kg)
12 lb
(5.4
kg)

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