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Vacuum Cluster Tool Integration System

 

Genmark Vacuum Cluster Tool Integration System for 200-300 mm Wafers

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Genmark introduces the latest addition to its family of factory automation solutions, the Vacuum Cluster Tool Integration System, a complete solution to meet your wafer transferring needs.  The Vacuum Cluster Tool Integration System includes Genmark’s MiniMax system Equipment Front End Module (EFEM), load lock options, customized vacuum transfer chamber, and an integrated vacuum robot, all controlled by Genmark’s GIFT Server.

 

Because of the system’s highly sophisticated design and flexibility, Genmark’s Vacuum Cluster Tool Integration System will support any vacuum process such as CVD, PVD,  Etch, and Photo Lithography.  Wafer cooling stations can also be integrated or built into the load locks or vacuum chamber.  Furthermore, the system is fully capable of integrating with Factory Automation solutions such as SMIF, AGV, FOUP, and Overhead Track.   

 

Genmark is ready to implement a total factory automation solution to help you achieve your high throughput and productivity goals.  Our system can be customized to meet any system and application requirement. 

Achieve Greater Return on Investment and Reduce Overall Cost-of-Ownership

  • Increase factory productivity and manufacturing yields
  • Improve facility and equipment utilization rates
  • Reduce manufacturing costs
  • Protect valuable wafers

Features

  • Flexible vacuum transfer chamber allows 5 to 8 process facets to support multi-step wafer processes
  • Customized wafer cooling stations adapt to all cooling requirements, resulting in higher throughput
  • Supports all low to high pressure vacuum processes
  • Handles all substrate sizes to adapt to all wafer processes
  • Meets Class 1 clean room requirements to ensure extreme cleanliness and ultimate performance
  • Offers option of top or bottom robot mounting in the front-end and in the vacuum transfer chamber

Product Specifications

SEMI Safety Standards :
  • SEMI S1-0701 – Safety Guidelines for Equipment Safety Labels

  • SEMI S2-1102 – Environmental, Safety, and Health Guideline for Semiconductor Manufacturing Equipment

  • SEMI S7-96 – Safety Guidelines for Environmental, Safety, and Health (EHS) Evaluation of Semiconductor Manufacturing Equipment

  • SEMI S8-0701 – Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment

  • SEMI S9-1101 – Safety Guidelines for Electrical Design Verification Tests for Semiconductor Manufacturing Equipment

  • SEMI S10-1296 – Safety Guidelines for Risk Assessment

  • SEMI S13- 0298 – Safety Guidelines for Operation and Maintenance Manuals Used with Semiconductor Manufacturing Equipment

SEMI Equipment Standards:
  • SEMI E15-0698 – Specification for Tool Load Port

  • SEMI E20-0697 – Cluster Tool Module Interface: Electrical Power and Emergency Off Standard

  • SEMI E21-94 – Cluster Tool Module Interface: Mechanical Interface and Wafer Transport Standard

  • SEMI E24-92 – Cluster Tool Module Interface: Isolation Valve Interlocks Standard

  • SEMI E25-92 – Cluster Tool Module Interface: Module Access Guideline

  • SEMI E26-92 – Radial Cluster Tool Footprint Standard

  • SEMI E44-96 ­– Guide for Procurement and Acceptance of Minienvironments

  • SEMI E54-0997 – Sensor/Actuator Network Standard

  • SEMI E57-0600 – Mechanical Specification for Kinematic Couplings Used to Align and Support 300mm Wafer Carriers

  • SEMI E58-0301 – Automated Reliability, Availability, and Maintenability Standards (ARAMS): Concepts, Behavior and Services

  • SEMI F47-0400 – Specification for voltage sag immunity

 

Facility Requirements

This section outlines the facility requirements for a typical Mini Max™ configuration.

ELECTRICAL POWER SUPPLY
Table 2.1. Electrical Specifications
AC input voltage: 230VAC-1Ø@50-60
UL 489 & CSA C22.2 Interrupting Ratings 240VAC 50.000A
277/480VAC 20.000A
IEC 947-2 Interrupting Ratings 230VAC 40.000A
415VAC 25.000A
500VAC 12.000A
250VAC 25.000A


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