Sort-Max™

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		Features Equipment Hardware Standards Equipment Software Standards

Genmark Automations Sorter is a next generation sorter producing the highest throughput utilizing clean technology, rapid software set-up, and lowest cost-of-ownership culminating from 18 years experience in design, development, and manufacture of wafer handling equipment. High throughput is achieved using Genmark Automations proven and reliable single, fully articulated, dual-arm Swap-Master robot. The Gimbal Positioning Robot (GPR) technology makes the robot capable of compliant interaction with misaligned wafers or modules and capable of deflection compensation during wafer transport. The Sorter is designed for handling 150mm - 300mm wafers or reticles, and can be customized to accommodate any mix of cassettes in 1,2, 3, and 4 load station configurations. A wide variety of wafer mappers and pre-aligners are some of its many options. The operation of a Sort-Max™ and the interfaced equipment can be controlled either by Genmark’s Automation software or by customer-supplied software. The Sort-Max produces a better than Class 1 mini-environment.

Features

• Sorter Functions: Sort, Map, Straight transfer, Merge, Split, Compress, Randomize, Flat/Notch Aligning
• Supported Wafer sizes 150mm-300mm
• Supported cassette types – FOUP, FOSB, Open Cassette
• Cross-slot and double slot wafer detection
• Operator Friendly Touch Screen Interface
• Optional host SECS/GEM Interface
• Support of Sort Process Programs
• Automatic pressure control system adjusts fan speed to maintain pressure set-points through changes in surrounding pressures.
• Integrated controls and monitoring system
• Fan-filter unit with VFD controlled impeller and PTFE media filter.
• Installation, certification, and balance to SEMI E-44-96.
• SEMI S2-93A, S6-93 compliant.

SEMI Standards Used to Verify Compliance:

• SEMI S2-0200
• SEMI S8-0600

Equipment Automation Hardware Standards

• EN 60204-1:1997 - 98/37/EC-Annex 1
• En55011
• En50082
• E51 Guide for Typical Facilities Services and Termination Matrix
• E70 Guide for Tool Accommodation Process
• E1.9 Mechanical Specification for Transport Cassette
• E15.1 Specification for Tool Load Port
• E47.1 Specification for Boxes and Pods used to Transport and store 300mm wafers
• E57 Specification for Kinematic Coupling wafer Carriers
• E62 Front-opening Interface Mechanical Standard
• E63 BOLTS (Box Opener/Loader to Tool Standard)

Equipment Automation Software Standards

• E04 SEMI Equipment Communications Standard 1 Message Transfer (SECS-I)
• E5 - SEMI equipment communications standard 2 message content (SECS-II)
• E30 Generic Equipment Model (GEM)
• E37 High Speed Messaging
• E39 Object Services Standard
• E40 Standard for Processing Management
• E84 Specification for Enhanced Carrier Handoff Parallel I/O Interface
• E87 Specification for Carrier Management (CMS)
• E90 Specification for Substrate Tracking
• E94 Control Job Management
• E95 Specification for Human Interface
• E99 Carrier ID Reader/writer Functional Standard
• E116 Specification for Equipment Performance Tracking
• E118 Specification for Wafer ID Reader Communication Interface