Mini-Max™ [EFEM]

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		Features Product Specifications Airborne Particle Test Facility Requirements

Genmark Automation’s MiniMax™ system Equipment Front End Module (EFEM) is designed to interface with various semiconductor processing equipment and back-end systems. Ranging in size, based on the number of BOLTS interfaces, a MiniMax™ can be customized to meet any system and application requirements. It can be interfaced with a complete line of Genmark Automation’s wafer and reticle handling equipment, including single or dual arm robots, prealigners, FOUP openers, FOSB openers and reticle libraries, as well as any other customer specified equipment. The operation of a MiniMax™ and the interfaced equipment can be controlled either by Genmark’s Automation software or by customer-supplied software. Additionally, the minienvironment also features the latest monitoring system. Each MiniMax is also designed to allow for bay wall or ballroom installations. Designed in compliance with SEMI and SEMATECH standards and guidelines, a MiniMax™ provides a Class 1 minienvironment suitable for all applications.

Features

• Automatic pressure control system adjusts fan speed to maintain pressure set-points through changes in surrounding pressures.
• Integrated controls and monitoring system
• Fan-filter unit with VFD controlled impeller and PTFE media filter.
• Integral lighting.
• Installation, certification, and balance to SEMI E-44-96.
• SEMI S2-93A, S6-93 compliant.
• CFD model available upon request

Product Specifications

• SEMI S2-0200
• SEMI S8-0600

• EN 60204-1:1997 - 98/37/EC-Annex 1
• EN55011
• EN50082
• E5 - SEMI equipment communications standard 2 message content (SECS-II)
• E30 Generic Equipment Model (GEM)
• E37 High Speed Messaging
• E39 Object Services Standard
• E40 Standard for Processing Management
• E51 Guide for Typical Facilities Services and Termination
• E70 Guide for Tool Accommodation Process
• E1.9 Transport Cassette
• E15.1 Equipment Load Port
• E47.1 Pods and Boxes
• E57 Kinetic Coupling
• E62 Front-opening Interface
• E63 BOLTS (Box Opener/Loader to Tool Standard)
• E84 Specification for Enhanced Carrier Handoff Parallel I/O Interface
• E87 Specification for Carrier Management (CMS)
• E90 Specification for Substrate Tracking
• E94 Control Job Management

The specifications and requirements are listed in the table below.

Parameter	Specification
1. Temperature
a. Rise across ME (vertical plane)	<=2.7°F(<=1.5)°C
b. Uniformity in ME (horizontal plane)	<=1.8°F(<=1.0)°C
2. Relative humidity (RH)	Test No specification
3. Air pressure: Relative to Cleanroom Ambient
a. Port closed	0.01+/-0.005"w.c. (2.5+/-0.13Pa)
b. Load/ unload	0.01+/-0.005"w.c. 0.01+/-0.005"w.c.
c. Minimum, any condition	(2.5+/-0.13Pa)(2.5+/-0.13Pa)
4. Air flow velocity
a. Velocity	90+/-10%ft/min (0.45+/-10%m/sec)
b. Flow visualization	Fog test w/video tape
5. Lighting Optional
a. Velocity	90+/-10%ft/min (0.45+/-10%m/sec)
b. Flow visualization	Fog test w/video tape
6. Contamination: Airborne particles/ Classification
a. Particle size	>=0.10µm
b. Particle concentration	<=1.0 particle/ft³ (<=35.3 particles/m³)
7. Ultraviolet Filtration (Light Transmission)
a. <500nm	0
b. 515nm	<=5%
c. 540nm	<=70%
8.Static Electric Charge on All Surfaces
a. maximum voltage	0+/-150V
9. ME Recovery Time	<=60 sec.
10. Outgassing of Materials
a. Rate (maximum)	5x10-8 torr-liter per cm²-s Testing method ASTM E-595
b. Total mass loss (TML)	<=0.2% Testing method ASTM E-595
11. Filter Performance	All filters will be tested by the filter manufacturer at their plant using a PSL polystyrene latex spheres. PTFE filter will be tested by vendor.
a. Particle penetration
1) 0.10µm particle size	<=0.00005%¹
2) Most penetrating particle size (MPPS)	<=0.00005%¹
b. Efficiency
1) 0.10µm particle size	<=99.99995%¹
2) Most penetrating particle size (MPPS)	<=99.99995%¹
c. Initial pressure drop	<=0.45" w.c. (<=114Pa)
12. Filter Fan Unit (FFU)
a. Power/unit flow rate	<0.25 watts/CFM (<9.0 watts/CMM)

Airborne Particle Test

Airborne Probe Placement
The airborne sample probe was positioned 0.5 - 1.0 inch from the sample locations, pointed toward the sample location. Where mechanical movement would create collision between the airborne probe and the moving part, the airborne sample probe was positioned 0.5 - 1.0 inch from the closest approach of that moving part.

Background Particles (Static Counts)
Background counts quantify the particles due to all factors except system movement. This includes particles from the test procedure itself.

Combined Robot Motions
For this test, the robot moved continuously in a simulated wafer transfer pattern. The movement pattern was:

• start at home position of theta and R with z-axis down
• move z-axis upward
• rotate 180 degrees
• extend end-effector
• retract end-effector
• rotate 180 degrees
• move z-axis downward

CONCLUSIONS: With combined motions, fell within the Federal standard 209E Class 1 limit.

Facility Requirements

ELECTRICAL POWER SUPPLY
Table 2.1. Electrical Specifications

AC input voltage:	230VAC-1Ø@50-60
UL 489 & CSA C22.2 Interrupting Ratings	240VAC 50.000A 277/480VAC 20.000A
IEC 947-2 Interrupting Ratings	230VAC 40.000A 415VAC 25.000A 500VAC 12.000A 250VAC 25.000A

VACUUM
Not less than 0.1 CFM air flow, at -40kPa(-5.8 psi).

PRESSURE SUPPLY
Pressure supply to the Mini Max™ is optional, depending on the interfacing modules. When required, the pressure supply to the system should be >= 0.01±0.005"w.c. (2.5±0.13Pa) operating, and 0.002"w.c. minimum.

EXHAUST
Exhaust connection from the Mini Max™ is optional, depending on the interfacing modules. All exhaust connections are to be connected to FAB exhaust.