The Genmark Edge-Gripping Standalone Pre-aligner delivers highly accurate wafer orientation with active edge-gripping mechanism. This autonomous device allows optimization between the accuracy and the performance of the alignment. It can be used as a standalone unit or work together with edge-gripping wafer handling robots.

The pre-aligner is designed to work with 300 mm substrates regardless of their coating and transparency characteristics. The wafer can be placed on a set of resting pins, or directly on the chuck of the pre-aligner itself. A specially designed motion sequence controls the substrate transfer between the chuck and the pins, minimizing the stress and the vibrations while delivering high throughput. A dedicated set of sensors control the accuracy of the wafer transfer and serve as interlocks to prevent wafer breakage in case of an inaccurate substrate delivery.

The orientation procedure consists of angular offset measurement and its compensation. A high-precision through-beam sensor detects the notch location. The device accuracy could be optimized by selecting lower operational speed. Alternatively, lowering precision tolerance would increase its performance. In the case the notch is covered by one of the chuck fingers, an extra alignment cycle is provided.

Key features:

• Non-contact measurement, zero contamination handling
• Active edge gripping mechanism
• Industry leading accuracy and performance
• Seamless integration with edge gripping robots
• Sensors providing reliable wafer transfer
• Buffer stage for additional throughput (available as an option)

Specification: