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GPR-SM (Swap Master)
The GPR-SM is a high-performance dual-arm robot employing Genmark Automation's breakthrough GPR Technology.
The robot combines the functionality of a three-link robotic arm, which performs
fast linear motion, with the motion of two end-effectors performing the wafer swapping
at the process chambers, source cassettes / FOUPs, pre-aligners, etc. The
decoupled mechanics of this robot contributes to its simplicity, modular design,
easy control, teaching, and programming. The GPR Technology makes the robot
capable of compliantly interact with misaligned cassettes and process modules,
as well as deliver deflection compensation during wafer transport. Advanced
motion planning in continuous smooth trajectories guarantee superior performance
and effective implementation in various front-and back-end layouts.
Features
- Minimizes the idle-time of the process modules due to quicker wafer-swap
- Modular design, decoupled mechanics, simple control, and programming
- Advanced motion planning and axes coordination
- Smallest footprint for it's reach, provides most efficient usage of the available space around the robotic-system
- In-line and radial cassettes / process chambers access capabilities
- Deflection compensation and compliant interaction with misaligned cassettes
- Patented GPR Technology
Applicable Directives/Standards
- Machine Directive 89/392/EEC
- Low Voltage Directive 73/23/EEC
- 89/336/EEC (EMC)
- SEMI S2-93A
Standards Used to Verify Compliance
- EN 55011
- EN 50082-1
- EN 60204-1
- EN 292-1
- EN 292-2
- MTBF > 80,000 hours
3 FOUP in-line access
Specification
- Arm Configurations:
- Global Translation Arm: 3-link 5.95"-11.9"-5.95"
- Dual Arm: 2-link 5.45"-5.45" or 6.46"-6.46"
- Motion Range
X = 47.0"
T = 680º
R and R2 = 21.8" (5.45"-5.45" dual arm)
R and R2 = 25.8" (6.46"-6.46" dual arm)
Z = 8" or 12.5" (each arm configuration may come with either of the listed motion ranges)
- Maximum velocity:
X = 60º/sec
T = 1500º/sec
R and R2 = 87.5 "/sec
Z = 20"/sec
- Maximum acceleration (X, R and R2,T,Z):
X = 80 º/sec²
T = 2500º/sec²
R = 200 "/sec²
Z = 40 "/sec².
- Minimum work envelope:
D = 23.5"
- Repeatability (X, R and R2,T,Z):
X = +/-0.001º
T = +/-0.005º
R = +/-0.001"
Z = +/-0.001"
- Robot weight: 85 lbs.
- Max wafer sizes: 300mm
- Payload capacity: 1.5 lbs.
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