GB8-DY

High Precision, High Payload, Wafer Transport Robot Featuring GPR™ Technology and Dual Yaw End-Effector

Utilizing Genmarks Patented Dual-Yaw technology, the Gencobot 8 Dual-Yaw allows fast and ultra-precise transport of wafers.  The Dual Yaw end-effector allows the highest speed of wafer swapping by handling two wafers at once.  The GB8-DY Robot combines increased reach and load capacity while employing Genmark Automation’s breakthrough patented GPR™ system. The GPR™ System is a six degrees of freedom servo-controlled robot that can compliantly interact with misaligned cassettes and process modules as well as deliver deflection compensation during transport. The Gencobot 8 Dual-Yaw is an exceptionally robust, structurally reinforced transport system capable of handling wafers measuring up to 300mm.

Thin Wafer Handling:
Genmark Automation has developed innovative approaches for handling thin wafers (down to 100 microns). Specially designed end-effector paddles, pre-aligner chucks, lifting pins, along with dedicated motion control software guarantee safe material handling overcoming increased wafer sag and fragility.

Specifications:

• Arm Configurations:
 8.05"-8.05",
 4.425"-8.85"-4.425",
 5.95"-11.9"-5.95",
 8.05"-16.1"-8.05",
 9"-18"-9"

• Maximum vertical stroke: 12.75", 17", 20" and 25"

• Maximum velocity :
 T = 600º/sec
 R = 50"/sec
 Z = 10"/sec
 Yaw1 = 1500º/sec
 Yaw2 = 1500º/sec

• Maximum acceleration:
 T = 1500º/sec²
 R = 200 "/sec²
 Z = 40 "/sec²
 Yaw1 = 2500º/sec²
 Yaw2 = 2500º/sec²

• Minimum work envelope:
 (Equipped with 6"-12"-6" arm and 9.5" end-effector)
 200 mm: D = 18"
 300 mm: D = 20"

• Repeatability:
 T = ± 0.01º
 R = ± 0.001"
 Z = ± 0.001"

• Robot weight: 170 lbs.

• Max wafer sizes: 300mm

• Payload capacity: 10 lbs.