GB7-S
High Precision, High Throughput, Wafer Transport Robot Featuring GPR Technology
Targeted for longer reach and higher payload applications, the Gencobot 7S Robot (GB7S) employs Genmark Automation's
breakthrough GPR System to achieve the highest
level of performance currently available in an automated wafer handler-capable
of handling up to 300mm diameter wafers. The GPR System, using Genmark Automation’s
patented technology, is a six degrees of freedom servo-controlled robot that can
compliantly interact with misaligned cassettes and process modules, as well as
deliver deflection compensation during transport. The unique yaw-axis feature of
the GB7S eliminates the need for radial placement of process stations/cassettes
around the robot, and can be used instead of a track system for a variety of
in-line processing applications. The GB7S can be fitted with various arm
configurations thus allowing it to accommodate a wide range of SMIF/cassettes
front-end layouts.
Thin Wafer Handling:
Genmark Automation has developed innovative approaches for handling thin wafers (down to
100 microns). Specially designed end-effector paddles, pre-aligner chucks,
lifting pins, along with dedicated motion control software guarantee safe
material handling overcoming increased wafer sag and fragility. The option of a flipping end-effector is also available.
Features
• GPR Technology
• Faster and more reliable robot movement
• Alignment free
• Deflection compensation
• Roll and pitch axes
• Optional Yaw or double Yaw-axes
• Optional multiple end-effector
• Optional remote Integral pre-aligner
• Multi-segment continuous path control
• In-line cassette access
Specification
• Arm Configurations:
5.25"-5.25",
8"-8",
4"-8"-4",
6"-12"-6"
• Maximum reach
Three-Link Arm (6”-12”-6”) 48”
Three-Link Arm (4”-8”-4”) 32”
Two-Link Arm (8”– 8”) 32"
Two-Link Arm (5.25”– 5.25”) 21"
• Maximum vertical stroke: 8", 12.5", 17", 20"
• Maximum velocity:
T = 800º/sec
R = 100"/sec
Z = 20"/sec
If equipped with Y and Y2 end-effector:
Y = 1500 º/sec
Y2 = 1500º/sec
• Maximum acceleration:
T = 2500º/sec²
R = 200 "/sec²
Z = 40 "/sec².
If equipped with Y and Y2 end-effector:
Y = 2500º/sec²
Y2 = 2500º/sec²
• Minimum work envelope:
(Equipped with 6"-12"-6" arm and 9.5" end-effector)
200mm wafer: D = 18"
300mm wafer: D = 20"
• Repeatability:
T = +/-0.01º
R = +/-0.001"
Z = +/-0.001"
• Robot weight: 75 lbs.
• Max wafer sizes: 300mm
• Payload capacity: 2.5lbs.
|