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GB7-S


High Precision, High Throughput, Wafer Transport Robot Featuring GPR™ Technology

GB7S

Targeted for longer reach and higher payload applications, the Gencobot 7S Robot (GB7S) employs Genmark Automation's breakthrough GPR™ System to achieve the highest level of performance currently available in an automated wafer handler-capable of handling up to 300mm diameter wafers. The GPR™ System, using Genmark Automation’s patented technology, is a six degrees of freedom servo-controlled robot that can compliantly interact with misaligned cassettes and process modules, as well as deliver deflection compensation during transport. The unique yaw-axis feature of the GB7S eliminates the need for radial placement of process stations/cassettes around the robot, and can be used instead of a track system for a variety of in-line processing applications. The GB7S can be fitted with various arm configurations thus allowing it to accommodate a wide range of SMIF/cassettes front-end layouts.

Thin Wafer Handling:

Genmark Automation has developed innovative approaches for handling thin wafers (down to 100 microns). Specially designed end-effector paddles, pre-aligner chucks, lifting pins, along with dedicated motion control software guarantee safe material handling overcoming increased wafer sag and fragility. The option of a flipping end-effector is also available.

Features

• GPR™ Technology
• Faster and more reliable robot movement
• Alignment free
• Deflection compensation
• Roll and pitch axes
• Optional Yaw or double Yaw-axes
• Optional multiple end-effector
• Optional remote Integral pre-aligner
• Multi-segment continuous path control
• In-line cassette access

Specification

• Arm Configurations:
 5.25"-5.25",
 8"-8",
 4"-8"-4",
 6"-12"-6"

• Maximum reach
  Three-Link Arm (6”-12”-6”) 48”
  Three-Link Arm (4”-8”-4”) 32”
  Two-Link Arm (8”– 8”) 32"
  Two-Link Arm (5.25”– 5.25”) 21"

• Maximum vertical stroke: 8", 12.5", 17", 20"

• Maximum velocity:
 T = 800º/sec
 R = 100"/sec
 Z = 20"/sec
 If equipped with Y and Y2 end-effector:
 Y = 1500 º/sec
 Y2 = 1500º/sec

• Maximum acceleration:
 T = 2500º/sec²
 R = 200 "/sec²
 Z = 40 "/sec².
 If equipped with Y and Y2 end-effector:
 Y = 2500º/sec²
 Y2 = 2500º/sec²

• Minimum work envelope:
 (Equipped with 6"-12"-6" arm and 9.5" end-effector)
 200mm wafer: D = 18"
 300mm wafer: D = 20"

• Repeatability:
 T = +/-0.01º
 R = +/-0.001"
 Z = +/-0.001"

• Robot weight: 75 lbs.

• Max wafer sizes: 300mm

• Payload capacity: 2.5lbs.


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