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GB7


Wafer Transport Robot featuring GPR™ Technology

GB7

The Gencobot 7 Robot (GB7) employs Genmark Automation's breakthrough GPR™ System to achieve the highest level of performance currently available in an automated wafer handler, which is capable of handling up to 300mm diameter wafers. The GPR™ System, using Genmark Automation's patented technology, is a six-degree of freedom servo-controlled robot that can compliantly interact with misaligned cassettes and process modules as well as deliver deflection compensation during transport. The unique yaw-axis feature of the GB7 eliminates the need for radial placement of process stations/cassettes around the robot, and can be used to replace a track system for a variety of in-line processing applications. The GB7 can have various arm configurations to accommodate a wide range of SMIF/cassettes front-end layouts.

Thin Wafer Handling:

Genmark Automation has developed innovative approaches for handling thin wafers (down to 100 microns). Specially designed end-effector paddles, pre-aligner chucks, lifting pins, along with dedicated motion control software guarantee safe material handling overcoming increased wafer sag and fragility. The option of a flipping end-effector is also available.

Features

  • GPR™ Technology
  • Alignment free
  • Deflection compensation
  • Roll and pitch axes
  • Optional Yaw or double Yaw-axes
  • Optional multiple end-effector
  • Optional remote Integral pre-aligner
  • Optional scanners with fast and slow scanning modes
  • Multi-segment continuous path control
  • In-line cassette access

Specification

  • Arm Configurations:
     4"-4"
     5.25"-5.25"
     8"-8"
     4"-8"-4"
     6"-12"-6"


  • Maximum reach
      Three-Link Arm (6”-12”-6”) - 48”
      Three-Link Arm (4”-8”-4”) - 32”
      Two-Link Arm (8”– 8”) - 32"
      Two-Link Arm (5.25”– 5.25”) - 21"
      Two-Link Arm (4”– 4”) - 16"


  • Maximum vertical stroke: 8", 12.5", 17", 20"


  • Maximum velocity:
     T = 800º/sec
     R = 50 "sec 
     Z = 20"/sec
     If equipped with Y and Y2 end-effector:
     Y = 1500 º/sec
     Y2 = 1500º/sec


  • Maximum acceleration:
     T = 2500º/sec²
     R = 200 "/sec²
     Z = 40 "/sec².
     If equipped with Y and Y2 end-effector:
     Y = 2500º/sec²
     Y2 = 2500º/sec²


  • Minimum work envelope:
     (Equipped with 6"-12"-6" arm and 9.5" end-effector)
     200 mm: D = 18"
     300 mm: D = 20"


  • Repeatability:
     T = +/-0.01º
     R = +/-0.001"
     Z = +/-0.001"


  • Robot weight: 72 lbs.


  • Max wafer sizes: 300 mm


  • Payload capacity: 2.5 lbs.



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