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GB7
Wafer Transport Robot featuring GPR Technology
The Gencobot 7 Robot (GB7) employs Genmark Automation's breakthrough GPR System to
achieve the highest level of performance currently available in an automated
wafer handler, which is capable of handling up to 300mm diameter wafers. The
GPR System, using Genmark Automation's patented technology, is a six-degree of freedom
servo-controlled robot that can compliantly interact with misaligned cassettes
and process modules as well as deliver deflection compensation during transport.
The unique yaw-axis feature of the GB7 eliminates the need for radial placement
of process stations/cassettes around the robot, and can be used to replace a
track system for a variety of in-line processing applications. The GB7 can have
various arm configurations to accommodate a wide range of SMIF/cassettes front-end layouts.
Thin Wafer Handling:
Genmark Automation has developed innovative approaches for handling thin wafers (down to
100 microns). Specially designed end-effector paddles, pre-aligner chucks,
lifting pins, along with dedicated motion control software guarantee safe
material handling overcoming increased wafer sag and fragility. The option of a flipping end-effector is also available.
Features
- GPR Technology
- Alignment free
- Deflection compensation
- Roll and pitch axes
- Optional Yaw or double Yaw-axes
- Optional multiple end-effector
- Optional remote Integral pre-aligner
- Optional scanners with fast and slow scanning modes
- Multi-segment continuous path control
- In-line cassette access
Specification
- Arm Configurations:
4"-4"
5.25"-5.25"
8"-8"
4"-8"-4"
6"-12"-6"
- Maximum reach
Three-Link Arm (6”-12”-6”) - 48”
Three-Link Arm (4”-8”-4”) - 32”
Two-Link Arm (8”– 8”) - 32"
Two-Link Arm (5.25”– 5.25”) - 21"
Two-Link Arm (4”– 4”) - 16"
- Maximum vertical stroke: 8", 12.5", 17", 20"
- Maximum velocity:
T = 800º/sec
R = 50 "sec
Z = 20"/sec
If equipped with Y and Y2 end-effector:
Y = 1500 º/sec
Y2 = 1500º/sec
- Maximum acceleration:
T = 2500º/sec²
R = 200 "/sec²
Z = 40 "/sec².
If equipped with Y and Y2 end-effector:
Y = 2500º/sec²
Y2 = 2500º/sec²
- Minimum work envelope:
(Equipped with 6"-12"-6" arm and 9.5" end-effector)
200 mm: D = 18"
300 mm: D = 20"
- Repeatability:
T = +/-0.01º
R = +/-0.001"
Z = +/-0.001"
- Robot weight: 72 lbs.
- Max wafer sizes: 300 mm
- Payload capacity: 2.5 lbs.
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