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GB4S


Wafer Transport Robot

GB4S

The Gencobot 4S (GB4S) is a high precision wafer handling robot that offers superior performance at an affordable price. Identical in size to Genmark Automation's popular GB4 Robot, the GB4S features many design enhancements that result in improved robot performance and reliability. Engineered for single or dual wafer transport, the GB4S robot is available in various reach and vertical stroke combinations. Genmark Automation's GB4S Robot used in conjunction with the RPA-0 Remote Pre-aligner, provides a highly accurate, highly repeatable pre-alignment and transport system at a very competitive package price for a variety of wafers and photomasks.

Thin Wafer Handling:
Genmark Automation has developed innovative approaches for handling thin wafers (down to 100 microns). Specially designed end-effector paddles, pre-aligner chucks, lifting pins, along with dedicated motion control software guarantee safe material handling overcoming increased wafer sag and fragility. The option of a flipping end-effector is also available.

Features
• Fast, accurate, repeatable transportation of wafers, and photomasks
• Extended reach and vertical travel combination
• Extended rotation motion range
• DSP-based motion controller for vibration- free wafer transport
• Multi-segment continuous path control
• Optional scanning feature with fast and slow scanning mode

Applicable Directives/Standards
• Machine Directive 89/392/EEC
• 89/336/EEC (EMC)
• S2-93A
• S8-95

Standards Used to Verify Compliance:
• EN 55011
• Annex 1 to the Directive
• EN 50082-1
• EN 60204-1

MTBF >80,000

Specification

• Arm Configurations:
  4"-8"-4",
  5.25" - 5.25"

• Maximum reach:
  Three-Link Arm  32”
  Two-Link Arm     21"

• Maximum vertical stroke: 20"

• Maximum velocity:
  T = 875º/sec
  R = 87.5"/sec
  Z = 30"/sec.

• Maximum acceleration:
  T = 2000º/sec²
  R = 200"/sec²
  Z = 40"/sec²

• Minimum work envelope:
  (Equipped with 4"-8"-4" arm and 7" end-effector, 200mm wafer)
   D = 13.35"

• Repeatability:
  T = ±0.01º
  R = ±0.001"
  Z = ±0.001"

• Max wafer sizes: 300mm

• Robot weight: 50 lbs.
  (for 7" vertical  travel and 4"-8"-4" arm)

• Payload capacity: 2 lbs.

AIRBORNE PARTICLE TEST

Test System Description

  • All airborne particle tests were run under carefully controlled conditions, and are an accurate representation of performance for the Genmark Automation Mini-environment components (robot plus pre-aligner, new FOUP opener, used FOUP opener). All testing was performed inside the Genmark Automation cleanroom in Sunnyvale, California.


  • Ceiling filters in the Genmark Automation cleanroom produced nominal Class 1000 air.


  • Air velocity and pressurization were set within the guidelines of Sematech's "Integrated Mini-environment Design Best Practices".


  • The test environment and the test components were cleaned with filtered isopropyl alcohol.

Each robot axis was tested separately with the airborne probe 0.5 - 1.0 inch from the movement joint:

Axis Move Particle size (Microns)
0.10 0.20 0.30 0.50 0.70 1.0
Theta 0 0 0 0 0 0
R 0 0 0 0 0 0
Z 0 0 0 0 0 0

• Z-Axis parameters: Speed - 15"/sec ; Acc - 20"/sec²; Travel - 7" ; Frequency was 1 cycle per second with 3 seconds delay

• Theta-Axis parameters: Speed - 5000/sec ; Acc - 5000/sec²; Travel - 1800 ; Frequency was 1 cycle per second with 3 seconds delay

• R-Axis parameters: Speed - 50"/sec ; Acc - 20"/sec²; Travel - 10"; Frequency was 1 cycle per second with 3 seconds delay

• Pre-aligner parameters: Linear motion was forward and backward 4.8 inches per second. Chuck rotation was the normal pre-aligner function


CONCLUSIONS: With separated motions, particles =0.1 µ fell within the ISO Class 2 limit.


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