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The Edge Gripping End Effector is an intelligent robot add-on, which provides
accurate edge gripping and handling of substrates, eliminating any contact with
the substrate top or bottom surfaces. It can be easily integrated in most of the
Genmark Robots product lines, expanding the versatility of the robots
applications.
Main Features:
- Edge gripping and handling of substrates
- High accuracy, performance and reliability
- Controlled gripping force
- Cost-effective, seamless integration with the Genmark robots
  
Technical Specification
| Wafer size |
300mm +/- 20% (SEMI M28-0997) |
| Wafer Thickness |
0.775 mm +/- 25% (SEMI M28-0997) |
| Minimum EE Length, measured from the center of the mounting hub to the center of the wafer |
9.23” [234.442 mm] |
| Maximum EE Length |
12.75” [323.85 mm] |
| Deflection of the EE tip – minimum Length |
0.035” [0.889 mm] |
| Deflection of the EE tip – maximum Length |
0.050” [1.27 mm] |
| End Effector Thickness at the paddle |
0.188” [4.775 mm] |
| Edge contact Area |
1.87 mm from the wafer edge, on the back (bottom) side of the wafer |
| Gripping force |
2lbf [0.907 kgf] |
| Wafer placement Accuracy |
- angular < 0.1 degree
- linear < 0.001” [0.0254 mm]
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| Cleanliness |
Class 1 |
| Maximum wafer protrusion |
0.1” [2.54 mm] |
| Area reserved for the EE between the wafer edge and the back wall of the FOUP |
- width = 2.20” [55.88 mm]
- depth = 0.25” [6.35 mm]
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| Material of the contact pads |
PEEK |
| Wafer present detection |
Yes |
| Pusher actuation |
DC motor, position sensors |
| Power requirements |
24 VDC, 300 mA |
| Environment |
Clean room class 100 or less |
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